New NearStack 100 Ohm and 85 Ohm Solutions Address Growing Need for Increased Signal Demands. Molex, a leading global manufacturer of electronic solutions, is pleased to announce the expansion of its industry-leading NearStack High-Speed Cable Solutions to include the NearStack 100 Ohm and NearStack 85 Ohm solutions. The extended portfolio helps organizations manage costs, reduce insertion loss and improve signal integrity.
Telecommunication and data center companies continue to experience increasing bandwidth requirements and, therefore, need high-density interconnects. To meet these needs, Molex continues to develop innovative connectivity solutions. One such group of solutions is theNearStack High-Speed Cable Assembly Solutions.
Tomorrow's speeds demand smarter solutions High-speed, high-density applications are moving away from traditional board designs to allow for high-speed lower-cost alternatives. The NearStack solutions optimize signal integrity channel performance with direct linkage, bypassing board traces and use of lower loss materials. Additionally, the computer science vs computer engineering salary solutions offer the potential to lower costs by removing re-timers and other active components from high-speed channels and reducing the numbers of high-speed layers that would need to be routed through expensive PCB materials.
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